
Honeywell Electronic Materials announced today it will more than double its refining and casting capacity for high-purity copper and tin at its Spokane, Washington facility in response to rising demand in the semiconductor industry.
Demand for the copper material has been steadily growing as new advanced chip designs continue to require high-purity copper. Additional industry growth has come as memory manufacturers transition from aluminum to copper. The use of copper and tin for advanced chip packaging applications is similarly on the rise.